課程目標 |
Cadence培訓高級班將首先讓您了解CB板上出現的信號反射、串擾、電源/地平面幹擾、時序匹配以及電磁兼容性等一系列問題産生的機理,並掌握其解決方法;然後講解並上機練習Cadence的高速
PCB設計與仿真工具SPECCTRAQuest的使用。使您在硬件設計過程中,能夠達到“設計即正確”的目的。 |
培養對象 |
在工作實踐中遇到了高速數字電路與高速PCB設計問題;對高速PCB設計感興趣的硬件工程師;已經具備一定的硬件開發經驗,需要增加就業競爭力的在校碩士及博士研究生;具備非常紮實的電子工程基本知識,並積累了相當程度的硬件工程師工作經驗的在校本科生。 |
班級規模及環境 |
爲了保證培訓效果,增加互動環節,我們堅持小班授課,每期報名人數限5人,多余人員安排到下一期進行。 |
質量保障 |
1、培訓過程中,如有部分內容理解不透或消化不好,可免費在以後培訓班中重聽;
2、培訓結束後免費提供一個月的技術支持,充分保證培訓後出效果;
3、培訓合格學員可享受免費推薦就業機會。 |
教學時間,教學地點 |
上課地點:【【上海總部】:同濟大學(滬西)/星河世紀廣場(11號線上海西站) 【深圳分部】:電影大廈(地鐵一號線大劇院站) 【北京分部】:北京中山學院/福鑫大樓 【南京分部】:金港大廈(和燕路) 【武漢分部】:佳源大厦(高新二路) 【成都分部】:領館區1號(中和大道)
近開課時間(周末班/連續班/晚班):Cadence高級班開課:即将开课,详情请咨询客服。(欢迎您垂询,视教育质量为生命!) |
學時 |
課時: 共5天,每天8學時,總計48學時 ◆外地學員:代理安排食宿(需提前預定)
☆注重質量
☆邊講邊練
☆合格學員免費推薦工作 |
課程進度安排 |
課程大綱 |
第一階段 |
1 高速PCB設計中的理論基礎
傳輸線理論、信號完整性(反射、串擾、過衝、地彈、振鈴等)、電磁兼容性和時序匹配等等。
2 SPECCTRAQuest設計流程
2.1 Pre-Placement
2.2 Board Setup Requirements
for Extracting and Applying Topologies
2.3 Database Setup Advisor
—Cross-Section
—DC
Nets
—DC
Voltages
—Device
Setup . ??—SI Models
—SI
Audit
|
3 拓撲結構的抽取與仿真 Extracting and Simulating Topologies
3.1 Pre-Route Extraction Setup—Default
Model Selection.
3.2 Pre-Route Extraction Setup—Unrouted
Interconnect
3.3 Pre-Route Template Extraction
3.4 SQ Signal Explorer Expert
3.5 Analysis Preferences
3.6 SigWave
3.7 Delay Measurements
|
第二階段 |
4 確定和施加約束 Determining and Adding ConstraintsSolution
4.1 Solution SpaceAnalysis:
Step 1 to 6
4.2 Parametric Sweeps.
4.3 Constraints :
Topology
Template Constraints
Switch/Settle
Constraints
Assigning
the Prop Delay Constraints
Impedance
Constraint
Relative
Propagation Delay Constraint
Diff
Pair Constraints
Max
Parallel Constraint
Wiring
Constraint
User-Defined
Constraint
Signal
Integrity Constraints
4.4 Usage of Constraints Defined
in Topology Template
|
5 模板應用和基于約束的布局
Template Applications and Constraint-Driven
Placement
5.1 Creating a Topology
5.2 Wiring the Topology
5.3 TLines and Trace Models
5.4 Coupled Traces
5.5 RLGC Matrix of Coupled Trace
Models
5.6 Crosstalk Simulation in
SQ Signal Explorer Expert
5.7 Simulating with Coupled-Trace
Models
5.8 Sweep Simulation Results
with Coupled-Trace Models
5.9 Extracting a Topology Using
the Constraint Manager
5.10 Electrical Constraint Set
5.11 Applying Electrical CSet
5.12 Worksheet Analysis
5.13 Spacing and Physical Rule
Sets
5.14 Electrical Rule Set
|
第三階段 |
6 基于約束的布線 Constraint-Driven Routing
6.1 Manual Routing
6.2 Routing with the SPECCTRA
Smart Route
6.3 Driving Constraints in Routing
7 布線後的DRC檢查和分析 Post-Route DRC and Analysis
7.1 Post-Route Analysis
7.2 SigNoise
7.3 Reflection Simulation
7.4 Reflection Waveform Analysis
7.5 Comprehensive Simulation
7.6 Crosstalk Simulation
7.7 Crosstalk Analysis
7.8 Simultaneous Switching Noise
Simulation
7.9 SSN Waveform Analysis
7.10 System-Level Analysis
7.11 A Complete Design Link
7.12 Initialize Design Link
|
8
差分信號設計 Differential Pair Design Exploration
8.1 Types of Differential Pairs
in SPECCTRAQuest
8.2 Create Differential Pair
Using SPECCTRAQuest
8.3 Create Differential Pair
Using Constraint Manager
8.4 Assigning Differential Pair
Signal Models
8.5 Preference to Extract Unrouted
Differential Pair Topology
8.6 Extracting Unrouted Differential
Pair Topology
8.7 Custom Stimulus to Analyze
Differential Pair Topology
8.8 Differential Pair Topology
Analysis
8.9 Coupled Trace Model and
Differential Pair Topology
8.10 Layout Cross-section Editor
8.11 Differential Pair Constraints
8.12 Differential Pair Constraints
in the Constraint Manager
8.13 Differential Pair Analysis
in the Constraint Manager
8.14 Post Route Extraction |